Pat Gillespie, Author at Cornell Duffield Engineering

Cornell showcases semiconductor leadership at 2025 SUPREME annual review

Cornell University hosted the 2025 SUPREME annual review, bringing together academia, industry, and government to advance next-generation semiconductor innovation and workforce development.

3D-printed superconductor achieves record performance

Nearly a decade after they first demonstrated that soft materials could guide the formation of superconductors, Cornell researchers have achieved a one-step, 3D printing method that produces superconductors with record properties.

Bioengineered bacteria could lead to therapeutic antibody drugs

A Cornell-led collaboration devised a potentially low-cost method for producing antibodies for therapeutic treatments: bioengineered bacteria with an overlooked enzyme that can help monoclonal antibodies boost their immune defenses.

Mako, a faculty-led startup based at Cornell Tech, raises $8.5 million

Mako, co-founded by assistant professor Mohamed Abdelfattah, sets out to tackle one of artificial intelligence’s most pressing infrastructure challenges: optimizing the computing efficiency of graphics processing units.

Plant cell wall mechanics inform how to grow usable forms

Cornell scientists work toward engineering plants and other organisms to grow into usable, biodegradable forms.

Olin Library to hold reopening celebration Aug. 27

The celebration also features a welcome speech at 12:15 p.m. by Elaine L. Westbrooks, Carl A. Kroch University Librarian, and open houses for the new Anthropology Collaboratory and Library Map Collection.

Nanoscale facility thinks big on developing microchip workforce

The Cornell NanoScale Science and Technology Facility has launched a free VR youth outreach module, designed to prepare the next generation of students in cutting-edge microchip fabrication.

Evans honored at ProComm 2025

Rick Evans, the emeritus Robert N. Noyce Director of the Engineering Communications Program, received the IEEE ProComm 2025 Ronald S. Blicq Award for Distinction in Technical Communication Education.

Paper featured in Advanced Materials

Fengqi You, the Roxanne E. and Michael J. Zak Professor in Energy Systems Engineering, had his review paper on applying large language models to materials science featured with art on the inside front cover of Advanced Materials.

Researchers build first ‘microwave brain’ on a chip

Cornell Engineering researchers have developed a low-power microchip they call a “microwave brain,” the first processor to compute on both ultrafast data signals and wireless communication signals by harnessing the physics of microwaves.